Tunable resonant circuit comprising a RF resonator geometry disposed on an active material layer such that resonance changes when photon energy is applied

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  • Publication Date:
    September 07, 2021
  • Additional Information
    • Patent Number:
      11114,738
    • Appl. No:
      16/101772
    • Application Filed:
      August 13, 2018
    • Abstract:
      Embodiments of the invention provide a resonant circuit including an active material substrate excitable by photon energy. A busline having a single input and a single output is located on the active material substrate. A RF resonator geometry is located on the active material substrate in electrical communication with the busline. Application of photon energy to the active material substrate changes the resonance of the RF resonator geometry at room temperatures. Alternately, a resonant circuit is provided that include a passive material substrate. An active material thin film is located on the passive material substrate. A busline having a single input and a single output and a RF resonator geometry located on the active material thin film. The RF resonator geometry is in electrical communication with the busline. Application of photon energy to the active material thin film changes the resonance of the RF resonator geometry at room temperatures.
    • Inventors:
      Government of the United States, as represented by the Secretary of the Air Force (Wright-Patterson AFB, OH, US)
    • Assignees:
      United States of America as represented by the Secretary of the Air Force (WPAFB, OH, US)
    • Claim:
      1. A resonant circuit comprising: an active material substrate having a top face; a busline having a single input and a single output located on the top face of the active material substrate; a RF resonator geometry located on the top face of the active material substrate in electrical communication with the busline, wherein application of photon energy to the active material substrate changes the resonance of the RF resonator geometry at room temperatures, and wherein the RF resonator geometry has a gap, and wherein the photon energy is applied to the gap of the RF resonator geometry, and wherein the RF resonator geometry comprises split ring resonators (SRRs).
    • Claim:
      2. The resonant circuit of claim 1 , wherein the active material substrate is selected from a group consisting of: semi-insulating (SI) GaAs, high-resistivity (HR) Si, epitaxial GaAs, epitaxial InAs, and combinations thereof.
    • Claim:
      3. A resonant circuit comprising: an active material substrate having a top face; a busline having a single input and a single output located on the top face of the active material substrate; a first RF resonator geometry tuned to a first frequency, the first RF resonator geometry located on the top face of the active material substrate in electrical communication with the busline; and a second RF resonator geometry tuned to a second frequency, the second RF resonator geometry located on the top face of the active material substrate in electrical communication with the busline, wherein application of photon energy to the active material substrate respectively changes the resonance of the first and second RF resonator geometry at room temperatures, wherein the first RF resonator geometry has a first gap and the second RF resonator geometry has a second gap, wherein the photon energy is applied to the first and second gap of the first and second RF resonator geometry, respectively, and wherein the first and second RF resonator geometry comprise split ring resonators (SRRs).
    • Claim:
      4. The resonant circuit of claim 3 , wherein the active material substrate is selected from a group consisting of: semi-insulating (SI) GaAs, high-resistivity (HR) Si, epitaxial GaAs, epitaxial InAs, and combinations thereof.
    • Claim:
      5. A resonant circuit comprising: a passive material substrate having a top face; an active material thin film located on the top face of the passive material substrate; a busline having a single input and a single output located on the active material thin film; a RF resonator geometry located on the active material thin film in electrical communication with the busline, wherein application of photon energy to the active material thin film changes the resonance of the RF resonator geometry at room temperatures.
    • Claim:
      6. The resonant circuit of claim 5 , wherein the RF resonator geometry is a first RF resonator geometry tuned to a first frequency, the resonant circuit further comprising: a second RF resonator geometry tuned to a second frequency, the second RF resonator geometry located on the active material thin film in electrical communication with the busline; wherein application of the photon energy to the active material thin film changes the resonance of the second RF resonator geometry at room temperatures.
    • Claim:
      7. The resonant circuit of claim 6 , wherein the second RF resonator geometry has a respective gap, and wherein the photon energy is applied to the respective gap of the second RF resonator geometry.
    • Claim:
      8. The resonant circuit of claim 7 , wherein the RF resonator geometry comprises split ring resonators (SRRs).
    • Claim:
      9. The resonant circuit of claim 5 , wherein the RF resonator geometry has a gap, and wherein the photon energy is applied to the gap of the RF resonator geometry.
    • Claim:
      10. The resonant circuit of claim 9 , wherein the RF resonator geometry comprises split ring resonators (SRRs).
    • Claim:
      11. The resonant circuit of claim 5 , wherein the active material thin film is selected from a group consisting of: semi-insulating (SI) GaAs, high-resistivity (HR) Si, epitaxial GaAs, epitaxial InAs, and combinations thereof.
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    • Primary Examiner:
      Lee, Benny T
    • Attorney, Agent or Firm:
      AFMCLO/JAZ
      Figer, Jr., Charles
    • Accession Number:
      edspgr.11114738